Project InterFlex

Interconnects for Flexible Foils

 

 

Motivation and Focus

Interconnects between components and functional foils constitute the missing link between building blocks and true large area flexible foil-based systems. The Interflex project targets enabling technologies for integration and interconnection of foil components, discrete components and foil subsystems into a flexible energy independent tag for environmental monitoring. New interconnection and assembly technologies will be developed tailored to the demands of manufacturing multilayer foil systems. Reliability investigations on interconnections will provide knowledge on quality of fabrication technologies and products. Together with standardisation of foil-to-foil and foil-to-components interconnections this strengthens commercialisation of flexible, organic and large area electronic foil systems.

 

Call FP7-ICT-2009.3.3:
Flexible, organic and large area electronics, Duration: 2010 - 2012