Innovations
 |
Transmitter chip for communication subsystem before (d = 370 µm) and after thinning (d = 25 µm).
© Melexis |
 |
Homogeneously integrated capacitive sensor structures on PI foil.
© Fraunhofer EMFT |
 |
Carbondioxide measuring unit, a stack of a foil
heater
and a
capacitive foil
trans-ducer coated with a sensing layer.
© Fraunhofer EMFT |
 |
Aerosol jet module integrated into a high precision cartesian
positioning
system, for printing wiring circuits,
interconnecting
foil components and via fill.
© Infotech Automation |
 |
Foil to foil via hole filled by jet dispensing © Bosch |
 |
Flexible thin film battery
on Polyimide substrate
© CEA |
 |
Thin film battery on Polyimide substrate
under cycling
© CEA |
 |
Flexible PV panel module
© ST Microelectronics, IT |